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OPTO SYSTEM Laser Scriber WSF8000

Highlights of the laser Scriber WSF8000

Laser Diode Manufacturing.

Or whichever scribing application on challenging materials we might yet not have thought of.

Up to 8" wafers on 12" frameholders.

Check out the smaller WSF4000 for 4" processing capability and the larger WSF8000 for 8" processing capability

Optional Ring Autoloader for up to 25 Frames.

Extend the no-need-for-interaction time. Automation for large volumes.

Laser-Scriber-WSF8000-Arikel

Full Automatic Operation.

State-of-the-art machine vision system, sensors and seamless operating motion with a fiber laser.

GaN, Sapphire And Si Configuration.

Whenever the material tends to break along undesired planes and you need more control on the breaking plane.

Very Flexible Custom Manual mode.

Focus on the physics of your process. Rely on a high precision tool.

A Number One (And Largest) Laser Scriber For 8” Wafers

Description of the Laser Scriber WSF8000

This laser scriber is our largest scriber and offers maximum speed and flexibility for scribing challenging semiconductors. The laser performs incisions through thermal ablation independently of crystal planes. This tool entirely made in Japan by Opto System Co. with a focus on robustness and quality is the workhorse scriber both for R+D labs and shopfloor semiconductor manufacturing around the world. Some customers have been using this tool for more than 10 years demonstrating operation with outstanding uptime. We offer options for different laser wavelengths depending on your substrate material and different tool sizes for smaller than 8 inch wafers. During the last decade, many small but helpful improvements have been added to the tool such as a dry particle removing system that make it great to work with. Send us your samples today and we will be happy to share our experience in processing parameters with you.

FAQ

Why not a diamond scriber ?

Scribing with a diamond scriber has been one of the most common methods for die separation. But it is easy to generate sub-par results if the substrate has a hexagonal lattice structure for instance. Diamond scribers apply pressure to create a crack and laser scribers cut into the semiconductor by thermally evaporating it (ablation). While a diamond scriber is a simpler tool and delivers great results on GaAs and InP, it is just easier to work with a laser scriber for GaN, Al2O3 or Si.

Do you Process my wafers ?

Right now we do not have the capability to act as an OEM manufacturer but we are looking for partners to be able to do so in the future. If you want to try out how our tools work on your devices, you are invited to send us some samples. We are eager to show off and learn about new applications. If you own Opto System tools and would like to offer OEM services, please get in touch too!

Can I switch among different wavelengths?

In our laser scriber we integrate a state-of-the-art fiber laser which is only capable of delivering a single wavelength. The different materials absorb light at different wavelengths and the specific fiber laser is dedicated for this material. This tool is delivered with just one wavelength of your choice but we can integrate more than one wavelength in one tool and would like to hear your request.

What are the critical process parameters?

A deep hands-on training at your location is part of our delivery. Prior to that it is best if you contact us and send us some samples. Our engineers will be happy as well to discuss your specific needs and share their decade long expertise with you. Besides that, we are building a Wiki site to collect experiences with our tools on this website. You can consult those basics on your own right here right now!

Are there other laser scriber versions from OptoSystem available?

The WSF4000 is the smallest laser scriber in our laser scriber family which can process 4” wafers (on 6” frames). The WSF6000 is technically the same tool but has a larger table and can process 6” wafers (on 8” frames). The WSF8000 is currently our largest tool with the capability of processing 8” wafers on 12 inch frames. We currently offer three different laser wavelengths to work with that can be combined on these tools. We would like to hear which laser needs you have for your substrate materials since Opto System is specialized in customizing tools for specific requirements.

What does it mean “custom half automatic operation mode”?

This scribing machine has a machine vision system, motors and sensors that allow a full automatic operation of a full wafer from beginning til end. Add the autoloader and up to 25 wafers can be processed at once. The laser scriber has also a joystick and index buttons to manually move and rotate the wafer, a monitor to see what the cameras see and perform all tasks manually while avoiding damaging the tool unintentionally. This allows a huge flexibility when trying something out in a very efficient way, because you choose which steps should run automatically and which steps should be done manually. All these settings can be saved as a recipe as well.

Why Opto System?

Opto System’s tools are built to last and very robust with a focus on performance and quality. Opto System has been around for for more than 40 years and has earned a reputation for excellent tools in the semiconductor industry across the world.

Who or What is Tomosemi?

TomoSemi is a manufacturer’s representative appointed by Opto System to promote Opto System’s products and to help customers in Europe since we are local.

Contact​

Phone: + 49.15678 719 479
Email: sales@tomosemi.com

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