A Number One Laser Scriber For 6” Wafers
Description of the Laser Scriber WSF6000
This laser scriber offers maximum speed and flexibility for scribing challenging semiconductors. The laser performs incisions through thermal ablation independently of crystal planes. This tool entirely made in Japan by OptoSystem Co. with a focus on robustness and quality is the workhorse scriber both for R+D labs and shopfloor semiconductor manufacturing around the world. Some customers have been using this tool for more than 10 years demonstrating operation with outstanding uptime. We offer options for different laser wavelengths depending on your substrate material and different tool sizes to accommodate up to 8 inch wafers. During the last decade, many small improvements have been added to the tool such as a dry particle removing system that make it great to work with. Send us your samples today and we will be happy to share our experience in processing parameters with you.